0xWheatyz
d1ff44802b
* firstpcb.step regenerated from current PCB (DRC-clean board with four M2 mounting holes). Two component 3D models (R_0805 and JST_XH_B4B-XH-A) fail to decompress under the Nix-packaged KiCad; affected components are missing 3D shapes but board body and other models are present. * pcbway_export/ contains gerbers (RS-274X Protel, 4.6 mm), separate PTH/NPTH Excellon drill files, drill maps, gbrjob, and a README with the stackup/spec. * firstpcb_pcbway.zip is the upload-ready archive for PCBWay. * .gitignore updated to drop KiCad autosaves and *.pre-drc-fix locals. Constraint: PCBWay accepts gerbers with Protel extensions and Excellon drills, separate PTH/NPTH preferred Directive: regenerate this package whenever the PCB changes -- the zip is a derived artifact; the source of truth is firstpcb.kicad_pcb
128 lines
2.6 KiB
Plaintext
128 lines
2.6 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "10.0.0"
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},
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"CreationDate": "2026-05-15T16:38:12-04:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "firstpcb",
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"GUID": "66697273-7470-4636-922e-6b696361645f",
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"Revision": "rev?"
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},
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"Size": {
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"X": 81.05,
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"Y": 60.05
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},
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"LayerNumber": 2,
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"BoardThickness": 1.6,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.2,
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"PadToTrack": 0.2,
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"TrackToTrack": 0.2,
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"MinLineWidth": 0.2,
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"TrackToRegion": 0.2,
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"RegionToRegion": 0.2
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}
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],
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"FilesAttributes": [
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{
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"Path": "firstpcb-F_Cu.gtl",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "firstpcb-B_Cu.gbl",
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"FileFunction": "Copper,L2,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "firstpcb-F_Paste.gtp",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "firstpcb-B_Paste.gbp",
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"FileFunction": "SolderPaste,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "firstpcb-F_Silkscreen.gto",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "firstpcb-B_Silkscreen.gbo",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "firstpcb-F_Mask.gts",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "firstpcb-B_Mask.gbs",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "firstpcb-Edge_Cuts.gm1",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "F.Cu/B.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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